AOT482L/aob482l 80v n-channel mosfet sdmos tm general description product summary v ds i d (at v gs =10v) 105a r ds(on) (at v gs =10v) < 7.2m ? r ds(on) (at v gs = 7v) < 9m ? 100% uis tested 100% r g tested symbol v ds v gs i dm i as , i ar e as , e ar t j , t stg symbol t 10s steady-state steady-state r jc 330 pulsed drain current c continuous drain current g parameter typ max t c =25c 2.1 167 t c =100c junction and storage temperature range -55 to 175 c thermal characteristics units maximum junction-to-ambient a c/w r ja 11 47 15 v 25 gate-source voltage drain-source voltage 80 the AOT482L/aob482l is fabricated with sdmos tm trench technology that combines excellent r ds(on) with low gate charge and low q rr .the result is outstanding efficiency with controlled switching behavior. this universal technology is well suited for pwm, load switching and general purpose applications. v maximum units parameter absolute maximum ratings t a =25c unless otherwise noted 80v avalanche energy l=0.1mh c mj avalanche current c 9 continuous drain current 336 11 a 82 a t a =25c i dsm a t a =70c i d 105 82 t c =25c t c =100c power dissipation b p d w power dissipation a p dsm w t a =70c 333 1.3 t a =25c maximum junction-to-case c/w c/w maximum junction-to-ambient a d 0.36 60 0.45 g d s to220 top view bottom view g g s d d s d d to-263 d 2 pa k top view bottom view d d s g g s pev 0: may 2010 www.aosmd.com page 1 of 7
AOT482L/aob482l symbol min typ max units bv dss 80 v v ds =80v, v gs =0v 10 t j =55c 50 i gss 100 na v gs(th) gate threshold voltage 2.5 3.1 3.7 v i d(on) 330 a 5.9 7.2 t j =125c 11 13 6.8 9 m ? 5.6 6.9 m ? 6.5 8.7 m ? g fs 50 s v sd 0.64 1 v i s 105 a c iss 3240 4054 4870 pf c oss 320 458 600 pf c rss 95 160 225 pf r g 0.2 0.45 0.7 ? q g (10v) 53 66.8 81 nc q gs 16 20.8 25 nc q gd 12 20.2 30 nc t d(on) 26 ns t r 18 ns t d(off) 48 ns t f 21 ns t rr 18 26 34 ns q rr 75 108 140 nc this product has been designed and qualified for the consumer market. applications or uses as critical components in life support devices or systems are not authorized. aos does not assume any liability arising out of such applications or uses of its products. aos reserves the right to improve product design, functions and reliability without notice. body diode reverse recovery charge i f =20a, di/dt=500a/ s maximum body-diode continuous current g input capacitance output capacitance turn-on delaytime dynamic parameters turn-on rise time turn-off delaytime v gs =10v, v ds =40v, r l =2 ? , r gen =3 ? gate resistance v gs =0v, v ds =0v, f=1mhz turn-off fall time total gate charge v gs =10v, v ds =40v, i d =20a gate source charge gate drain charge m ? to220 i s =1a,v gs =0v v ds =5v, i d =20a v gs =7v, i d =20a to220 v gs =10v, i d =20a to263 v gs =7v, i d =20a to263 forward transconductance diode forward voltage r ds(on) static drain-source on-resistance i dss a v ds =v gs i d =250 a v ds =0v, v gs = 25v zero gate voltage drain current gate-body leakage current electrical characteristics (t j =25c unless otherwise noted) static parameters parameter conditions body diode reverse recovery time drain-source breakdown voltage on state drain current i d =250 a, v gs =0v v gs =10v, v ds =5v v gs =10v, i d =20a reverse transfer capacitance i f =20a, di/dt=500a/ s v gs =0v, v ds =40v, f=1mhz switching parameters a. the value of r ja is measured with the device mounted on 1in 2 fr-4 board with 2oz. copper, in a still air environment with t a =25c. the power dissipation p dsm is based on r ja and the maximum allowed junction temperature of 150c. the value in any given application depends on the user's specific board design, and the maximum temperature of 175c may be used if the pcb allows it. b. the power dissipation p d is based on t j(max) =175c, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. c. repetitive rating, pulse width limited by junction temperature t j(max) =175c. ratings are based on low frequency and duty cycles to keep initial t j =25c. d. the r ja is the sum of the thermal impedence from junction to case r jc and case to ambient. e. the static characteristics in figures 1 to 6 are obtained using <300 s pulses, duty cycle 0.5% max. f. these curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsi nk, assuming a maximum junction temperature of t j(max) =175c. the soa curve provides a single pulse rating. g. the maximum current rating is package limited. h. these tests are performed with the device mounted on 1 in 2 fr-4 board with 2oz. copper, in a still air environment with t a =25c. rev 0: may 2010 www.aosmd.com page 2 of 7
AOT482L/aob482l typical electrical and thermal characteristic s 17 5 2 10 0 18 40 0 20 40 60 80 100 34567 v gs (volts) figure 2: transfer characteristics (note e) i d (a) 2 4 6 8 10 12 0 5 10 15 20 25 30 i d (a) figure 3: on-resistance vs. drain current and gate voltage (note e) r ds(on) (m ? ) 1.0e-04 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 0.0 0.2 0.4 0.6 0.8 1.0 v sd (volts) figure 6: body-diode characteristics (note e) i s (a) 25c 125c 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 0 25 50 75 100 125 150 175 200 temperature (c) figure 4: on-resistance vs. junction temperature (note e) normalized on-resistance v gs =7v i d =20a v gs =10v i d =20a 4 6 8 10 12 14 16 5678910 v gs (volts) figure 5: on-resistance vs. gate-source voltage (note e) r ds(on) (m ? ) 25c 125c v ds =5v v gs =7v v gs =10v i d =20a 25c 125c 0 20 40 60 80 100 012345 v ds (volts) fig 1: on-region characteristics (note e) i d (a) v gs =5v 5.5v 7v 10v 6v rev 0: may 2010 www.aosmd.com page 3 of 7
AOT482L/aob482l typical electrical and thermal characteristic s 17 5 2 10 0 18 40 0 2 4 6 8 10 0 10203040506070 q g (nc) figure 7: gate-charge characteristics v gs (volts) 0 1000 2000 3000 4000 5000 6000 0 1020304050607080 v ds (volts) figure 8: capacitance characteristics capacitance (pf) c iss 0 1000 2000 3000 4000 5000 1e-05 0.0001 0.001 0.01 0.1 1 10 pulse width (s) figure 10: single pulse power rating junction-to- case (note f) power (w) 0.001 0.01 0.1 1 10 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 pulse width (s) figure 11: normalized maximum transient thermal impedance (note f) z jc normalized transient thermal resistance c oss c rs s v ds =40v i d =20a single pulse d=t on /t t j,pk =t c +p dm .z jc .r jc t on t p d in descending order d=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse t j(max) =175c t c =25c 10 v ds (volts) i d (amps) figure 9: maximum forward biased safe operating area (note f) 10 jc =0.45c/w rev 0: may 2010 www.aosmd.com page 4 of 7
AOT482L/aob482l typical electrical and thermal characteristic s 17 5 2 10 0 18 40 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 1000 pulse width (s) figure 16: normalized maximum transient thermal impedance (note h) z ja normalized transient thermal resistance single pulse d=t on /t t j,pk =t a +p dm .z ja .r ja t on t p d in descending order d=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 0 50 100 150 200 250 300 350 0 25 50 75 100 125 150 175 t case (c) figure 13: power de-rating (note f) power dissipation (w) 0 20 40 60 80 100 120 0 25 50 75 100 125 150 175 t case (c) figure 14: current de-rating (note f) current rating i d (a) 1 10 100 1000 0.01 1 100 pulse width (s) figure 15: single pulse power rating junction-to- ambient (note h) power (w) t a =25c r ja =60c/w 1 10 100 1000 1 10 100 1000 time in avalanche, t a ( s) figure 12: single pulse avalanche capability (note c) i ar (a) peak avalanche current t a =25c t a =150c t a =100c t a =125c rev 0: may 2010 www.aosmd.com page 5 of 7
AOT482L/aob482l typical electrical and thermal characteristic s 0 40 80 120 160 200 240 0 5 10 15 20 25 30 i s (a) figure 17: diode reverse recovery charge and peak current vs. conduction current q rr (nc) 0 5 10 15 20 25 30 35 40 45 50 i rm (a) di/dt=800a/ s 125oc 125oc 25oc 25oc q rr i rm 0 50 100 150 200 250 0 200 400 600 800 1000 di/dt (a/ s) figure 19: diode reverse recovery charge and peak current vs. di/dt q rr (nc) 0 10 20 30 40 50 i rm (a) 125oc 125oc 25oc 25oc i s =20a q rr i rm 0 5 10 15 20 25 30 35 0 5 10 15 20 25 30 i s (a) figure 18: diode reverse recovery time and softness factor vs. conduction current t rr (ns) 0 0.5 1 1.5 2 2.5 3 s di/dt=800a/ s 125oc 25oc 25oc 125o t rr s 0 10 20 30 40 50 0 200 400 600 800 1000 di/dt (a/ s) figure 20: diode reverse recovery time and softness factor vs. di/dt t rr (ns) 0 0.5 1 1.5 2 2.5 s 125oc 125oc 25oc 25oc i s =20a t rr s rev 0: may 2010 www.aosmd.com page 6 of 7
AOT482L/aob482l - + vdc ig vds dut - + vdc vgs vgs 10v qg qgs qgd charge gate charge test circuit & waveform - + vdc dut vdd vgs vds vgs rl rg vgs vds 10% 90% resistive switching test circuit & waveforms tt r d(on) t on t d(off) t f t off vdd vgs id vgs rg dut - + vdc l vgs vds id vgs bv i unclamped inductive switching (uis) test circuit & waveforms ig vgs - + vdc dut l vds vgs vds isd isd diode recovery test circuit & waveforms vds - vds + i f ar dss 2 e = 1/2 li di/dt i rm rr vdd vdd q = - idt ar ar t rr rev 0: may 2010 www.aosmd.com page 7 of 7
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